搜尋結果
Semiconductor. Industry. Nanoelectronics. v. t. e. A semiconductor is a material that has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity generally falls as its temperature rises; metals behave in the opposite way. [1]
Magnetic semiconductors are semiconductor materials that exhibit both ferromagnetism (or a similar response) and useful semiconductor properties. If implemented in devices, these materials could provide a new type of control of conduction. Whereas traditional electronics are based on control of charge carriers ( n- or p-type ), practical ...
Architecture Example of the PCI Express topology: white "junction boxes" represent PCI Express device downstream ports, while the gray ones represent upstream ports.: 7 PCI Express x1 card containing a PCI Express switch (covered by a small heat sink), which creates multiple endpoints out of one endpoint and lets multiple devices share it The PCIe slots on a motherboard are often labeled with ...
The 3rd Generation Partnership Project ( 3GPP) is an umbrella term for a number of standards organizations which develop protocols for mobile telecommunications. Its best known work is the development and maintenance of: [1] GSM and related 2G and 2.5G standards, including GPRS and EDGE. UMTS and related 3G standards, including HSPA and HSPA+.
Latest 13th and 14th generation Core Desktop - Raptor Lake-S Refresh (codenamed "Raptor Lake") (14th Gen)An iterative refresh of Raptor Lake-S desktop processors, called the 14th generation of Intel Core, was launched on October 17, 2023. CPUs in bold below feature ECC memory support only when paired with a motherboard based on the W680 chipset according to each respective Intel Ark product page.
a Note: The E8190 and E8290 do not support Intel VT-d. See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand. "Yorkfield-6M" (45 nm) All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d ...
The demon core (like the core used in the bombing of Nagasaki) was, when assembled, a solid 6.2-kilogram (14 lb) sphere measuring 8.9 centimeters (3.5 in) in diameter. It consisted of three parts: two plutonium-gallium hemispheres and a ring, designed to keep neutron flux from "jetting" out of the joined surface between the hemispheres during ...
