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3. PROCESS CONDITION. cured at 140deg.C for 20 minutes x 2 cycles. In case no marking ink is applied, solder mask should be cured at. 150deg.C for 60 minutes. 4. ATTENTION IN PROCESS: As to the operation environment. It is desirable to deal with the ink under the yellow lamps in the clean room.
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FEATURES . PSR-4000 GEC50K1/CA-40 G50 is two component, liquid photoimageable solder resist (alkaline developable type) with following features: . High sensitivity. Excellent electrolytic/electroless Ni/Au resistance. Excellent in water-soluble flux resistance. Non halogen content and low outgas emission. SPECIFICATION. *: After mixing. 3.
Hold time. 10min 10-20min. Development. Aqueous alkaline solution : 1wt% Na2CO3 Temperature of developer : 30deg.C Spray pressure : 0.2MPa 0.15-0.25MPa Developing time : 60sec 60-100sec. Water rinse. Temperature of rinsing water : 25deg.C Below 30deg.C Spray pressure : 0.1MPa 0.1-0.15MPa Rinsing time : 45sec 45-60sec. Post cure.
Exposure. 80mJ/cm2 (on solder mask ) 40-100mJ/cm2 Using by ORC Direct Imaging Exposure machine(Di-IMPACT DXP3512) *use cut filter below 355nm. Hold time. 10min 10-20min. Development. Aqueous alkaline solution : 1wt% Na2CO3 Temperature of developer : 30deg.C Spray pressure : 0.2MPa 0.15-0.25MPa Developing time : 60sec 60-100sec. Water rinse.
Exposure. Metal halide lamp 7kw (ORC HMW-680) 350mJ/cm2 (on solder 280-420mJ/cm2 mask) Hold time. 15min 10-20min. Development. Aqueous alkaline solution : 1wt% Na2CO3 Temperature of developer : 30deg.C Spray pressure : 0.2MPa 0.15-0.25MPa Developing time : 60sec 60-90sec. Water rinse.
Title TAIYOINK_03 Created Date 12/25/2019 12:56:27 PM
Title 01_ECM-100_ol_V10.ai Author KURODAwin Created Date 4/20/2009 5:59:53 PM
