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FEATURES. PSR-4000 GEC50K1/CA-40 G50 is two component, liquid photoimageable solder resist (alkaline developable type) with following features: High sensitivity. Excellent electrolytic/electroless Ni/Au resistance. Excellent in water-soluble flux resistance. Non halogen content and low outgas emission.
TAIYO JAPAN COMPANY, LIMITED inherited the rights and obligations regarding operations involving the manufacture and sale and the resale of chemical products for electronic components including printed wiring board materials, and changed its name to Taiyo Ink Mfg. Co., Ltd. 2014. Apr. Completed the 2nd factory on the site of our head office. 2015.
3. PROCESS CONDITION. cured at 140deg.C for 20 minutes x 2 cycles. In case no marking ink is applied, solder mask should be cured at. 150deg.C for 60 minutes. 4. ATTENTION IN PROCESS: As to the operation environment. It is desirable to deal with the ink under the yellow lamps in the clean room.
Taiyo Ink MFG is a chemical manufacturer with a high market share of solder resist (SR), an essential material in printed circuit boards (PCBs). With solder resist engineering we have built up, we continuously grow our existing businesses, create new business domains, and contribute to innovations in electronics technology.
2nd chamber Temperature: 80deg.C 60-80deg.C Pressure: 60sec. at 8Kgf/cm2. Exposure. Contact exposure machine. ORC MANUFACTURING CO.,LTD EXP-2960 Luminace: 35mW/cm2 500mJ/cm2 ( on career film) 400-500mJ/cm2 Ambient temp 23.5 +/- 0.5deg.C. Hold time. 10min 10-20min. Development.
Solder resist is an insulating ink that covers the surface of printed circuit boards (PCBs) and protects the circuit pattern. One of the main roles of solder resist is to prevent solder from adhering to unnecessary parts when components are mounted on the board.
Exposure. Metal halide lamp 7kw (ORC HMW-680) 350mJ/cm2 (on solder 280-420mJ/cm2 mask) Hold time. 15min 10-20min. Development. Aqueous alkaline solution : 1wt% Na2CO3 Temperature of developer : 30deg.C Spray pressure : 0.2MPa 0.15-0.25MPa Developing time : 60sec 60-90sec. Water rinse.
