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New Employee Orientation & Physical Examination. Taiwan Resident Certificate. (ARC) Insurance. Expense Reimbursement. Get Settled. TSMC amplifies the friendly ambience of Taiwan and integrates it into our corporate culture. Inclusiveness is not only a goal for us, it is more a defining character of us.
In a historic announcement, in May 2020, TSMC shared its plans to invest $12B in Phoenix, Arizona – building an advanced semiconductor manufacturing fabrication. In December 2022, the company announced its commitment to build a second fab in Phoenix, increasing its total investment to $40B. This represents the largest foreign direct ...
ULP. TSMC provides an industry-leading specialty technologies portfolio that complements its advanced technology leadership. The Company's comprehensive specialty technologies meet specific customer needs and include MEMS, CMOS Image Sensor, Embedded NVM, RF, Analog, High Voltage, and BCD-Power processes, and so on.
TSMC IoT Platform's comprehensive ultra-low power offerings: Process technologies with proven manufacturing track record: 55nm ULP, 40nm ULP, 28nm ULP, 22nm ULP/ULL, and 12FFC+_ULL. Low operating voltage (Vdd) technologies for extreme low power applications. Specialty technologies including enhanced RF and Analog,Embedded Non-Volatile Memory ...
台积公司于2022年领先业界成功大量量产3奈米鳍式场效晶体管（3nm FinFET, N3）制程技术。. N3为业界最先进的半导体逻辑制程技术，具备最佳的效能、功耗及面积（PPA），是继5奈米（N5）制程技术之后的另一个全世代制程。. 继N3制程技术之后，台积公司推出支持更 ...
eFlash. TSMC provides an industry-leading specialty technologies portfolio that complements its advanced technology leadership. The Company's comprehensive specialty technologies meet specific customer needs and include MEMS, CMOS Image Sensor, Embedded NVM, RF, Analog, High Voltage, and BCD-Power processes, and so on.
BCD for Power Efficiency. Automotive demand for high performance Bipolar-CMOS -DMOS (BCD) to support the growing number of electronics, extended battery life and improved fuel efficiency is rapidly increasing. High voltage low-Ron power devices in BCD technology enhance system integration and improve overall power efficiency.
