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Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.
A light-emitting diode (LED) is a semiconductor device that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons.
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What is wafer-level packaging (WLP)?
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What is wafer-level chip scale packaging (WL-CSP)?
Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions.
This produced a commercially packaged white light giving 65 lm/W at 20 mA, becoming the brightest white LED commercially available at the time, and more than four times as efficient as standard incandescents. In 2006, they demonstrated a prototype with a record white LED luminous efficacy of 131 lm/W at 20 mA.
- Package Functions
- Leads
- Sockets
- Package Materials
- Hybrid Integrated Circuits
- Special Packages
- Standards
- See Also
- External Links
A semiconductor package may have as few as two leads or contacts for devices such as diodes, or in the case of advanced microprocessors, a package may have hundreds of connections. Very small packages may be supported only by their wire leads. Larger devices, intended for high-power applications, are installed in carefully designed heat sinks so th...
To make connections between an integrated circuit and the leads of the package, wire bonds are used, with fine wires connected from the package leads and bonded to conductive pads on the semiconductor die. At the outside of the package, wire leads may be soldered to a printed circuit board or used to secure the device to a tag strip. Modern surface...
Early semiconductor devices were often inserted in sockets, like vacuum tubes. As devices improved, eventually sockets proved unnecessary for reliability, and devices were directly solderedto printed circuit boards. The package must handle the high temperature gradients of soldering without putting stress on the semiconductor die or its leads. Sock...
Many devices are molded out of an epoxy plastic that provides adequate protection of the semiconductor devices, and mechanical strength to support the leads and handling of the package. The plastic can be cresol-novolaks, siloxane polyimide, polyxylylene, silicones, polyepoxides and bisbenzocyclo-butene. Some devices, intended for high-reliability ...
Multiple semiconductor dies and discrete components can be assembled on a ceramic substrate and interconnected with wire bonds. The substrate bears leads for connection to an external circuit, and the whole is covered with a welded or frit cover. Such devices are used when requirements exceed the performance (heat dissipation, noise, voltage rating...
Semiconductor packages may include special features. Light-emitting or light-sensing devices must have a transparent window in the package; other devices such as transistors may be disturbed by stray light and require an opaque package. An ultraviolet erasable programmable read-only memory device needs a quartz window to allow ultraviolet lightto e...
Just like vacuum tubes, semiconductor packages standards may be defined by national or international industry associations such as JEDEC, Pro Electron, or EIAJ, or may be proprietary to a single manufacturer. 1. Assorted discrete through-holecomponents 2. A microprocessor in a ceramic, dual in-line packagewith 48 pins. 3. A silicon wafer; individua...
In electronics, a wafer (also called a slice or substrate) [1] is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound.
What is a wafer-level packaged white LED? 相關
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