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1. eps.ieee.org › images › filesChapter 23: Wafer-Level Packaging (WLP) - IEEE

   eps.ieee.org › images › files

   Wafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or functional components like micro-electromechanical systems (MEMS) or radio-frequency (RF) filters.

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2. en.wikipedia.org › wiki › Wafer-level_packagingWafer-level packaging - Wikipedia

   en.wikipedia.org › wiki › Wafer-level_packaging

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   Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.

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4. ieeexplore.ieee.org › document › 6756667A novel wafer level packaging for white light LED - IEEE Xplore

   ieeexplore.ieee.org › document › 6756667

   After the first white light-emitting diodes (WLEDs) became commercially available, much attention has been paid to the development of WLEDs because of their ext

5. ieeexplore.ieee.org › document › 6507885LED wafer level packaging with a remote phosphor cap

   ieeexplore.ieee.org › document › 6507885

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   2012年12月16日 · In this paper, a new structure for 3D wafer level LED packaging is introduced. The package consists of three parts: a silicon submount wafer with pre-mounted LEDs, a silicon cap wafer, and a layer of phosphor film. Each part was independently fabricated and

6. www.semanticscholar.org › paper › A-novel-wafer-levelA novel wafer level packaging for white light LED

   www.semanticscholar.org › paper › A-novel-wafer-level

   2013年8月1日 · In this paper, a novel packaging for white LED, benefit from Si material and TSV array used in the wafer level LED package, the capability of thermal dissipation could be enhanced.

7. 其他人也問了

   What is wafer level packaging?

   • Wafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or functional components like micro-electromechanical systems (MEMS) or radio-frequency (RF) filters.

   Chapter 23: Wafer-Level Packaging (WLP) - IEEE

   eps.ieee.org/images/files/HIR_2021/ch23-wlpfinal2.pdf

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   What is wafer-level packaging (WLP)?

   • WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.

   Wafer-level packaging - Wikipedia

   en.wikipedia.org/wiki/Wafer-level_packaging

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   What is wafer level chip scale packaging (WLCSP)?

   • Both processes were an extension of standard Wafer Level Chip Scale Packaging (WLCSP) processing technology, with the “wafer level” processing performed on a plastic molded reconstituted wafer instead of the standard silicon wafer. The die were first singulated and embedded on five sides in a mold compound, leaving the die pad side exposed.

   Chapter 23: Wafer-Level Packaging (WLP) - IEEE

   eps.ieee.org/images/files/HIR_2021/ch23-wlpfinal2.pdf

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   What are the industry firsts in wafer level package?

   • Technologically, InFO created several “industry firsts in wafer level package”: Packaging size larger than 10x10mm2, Chip size larger than 8x8mm2 with very high BGA pin count. First mobile AP PoP package with final thickness below 1mm.

   Chapter 23: Wafer Level Packaging - IEEE

   eps.ieee.org/images/files/HIR_2019/HIR1_ch23_WLP.pdf

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8. eps.ieee.org › images › filesChapter 23: Wafer Level Packaging - IEEE

   eps.ieee.org › images › files

   The intent of this chapter is to provide a brief overview of Wafer Level Packaging (WLP), including Wafer Level Chip Scale Packaging (WLCSP) and Fan Out packaging, as a background for a roadmap for these technologies going

9. www.izm.fraunhofer.de › content › damHermetic WLP of LEDs for White Light Applications - Fraunhofer

   www.izm.fraunhofer.de › content › dam

   Fraunhofer IZM has developed a new hermetic wafer level packaging approach for fabrication of white light LEDs with suspended phosphor ceramic converter. In this new architecture, the ceramic converter is not directly attached to the LED chip but part of the package and is arranged with a defined distance to the LED.