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Wafer level packaging is where a die is packaged while still in wafer form, either singly or combined with additional dies or other components such as discrete passive devices, or functional components like micro-electromechanical systems (MEMS) or radio-frequency (RF) filters.
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Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.
After the first white light-emitting diodes (WLEDs) became commercially available, much attention has been paid to the development of WLEDs because of their ext
2012年12月16日 · In this paper, a new structure for 3D wafer level LED packaging is introduced. The package consists of three parts: a silicon submount wafer with pre-mounted LEDs, a silicon cap wafer, and a layer of phosphor film. Each part was independently fabricated and
2013年8月1日 · In this paper, a novel packaging for white LED, benefit from Si material and TSV array used in the wafer level LED package, the capability of thermal dissipation could be enhanced.
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The intent of this chapter is to provide a brief overview of Wafer Level Packaging (WLP), including Wafer Level Chip Scale Packaging (WLCSP) and Fan Out packaging, as a background for a roadmap for these technologies going
Fraunhofer IZM has developed a new hermetic wafer level packaging approach for fabrication of white light LEDs with suspended phosphor ceramic converter. In this new architecture, the ceramic converter is not directly attached to the LED chip but part of the package and is arranged with a defined distance to the LED.
What is a wafer-level packaged white LED? 相關
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