Yahoo奇摩 網頁搜尋

  1. 相關搜尋:

搜尋結果

  1. PTI is the world's leading provider of turnkey services for chip probing, packaging, and testing. Being one of the most robust packaging option, we maintain a comprehensive portfolio of leadframe packages like QFN, TSOP, and others to address the diverse end markets.

  2. PTI is the world's leading provider of turnkey services for chip probing, packaging, and testing. Being one of the most robust packaging option, we maintain a comprehensive portfolio of leadframe packages like QFN, TSOP, and others to address the diverse end markets.

  3. Powertech Technology Inc. (PTI), the world's leading OSAT, was founded in 1997. We serve the international customers with services including chip bumping, chip probing, IC assembly, final testing, burn in, and system level assembly.

  4. Locations - Powertech Technology Inc. Core Value and Corporate Sustainable Development Policy. Establish Bilateral Connection Between Industries and Universities. Home. About Us. Locations. No.10, Datong Rd., Hsinchu Industrial Park, Hukou, Hsinchu 303035, Taiwan.

  5. 稳健的成长、永续的经营」是力成的理念;以最佳的质量,成本,交付和服务为基础,并以技术驱动未来成长,是力成的策略;持续积极履行「承诺、技术、整合」是力成的核心价值。. 结合力成的理念、策略与核心价值,成为最佳经营绩效的世界级专业委外封 ...

  6. Technologies Innovative Technology Trademarks Services Final Test IC Packaging Module Assembly Investor Relations Financial Information Corporate Governance Shareholder Services Investor Events & News ESG Sustainable Corporate Operation Stakeholders ...

  7. 整合. 「穩健的成長、永續的經營」是力成的理念;以最佳的品質,成本,交付和服務為基礎,並以技術驅動未來成長,是力成的策略;持續積極履行「承諾、技術、整合」是力成的核心價值。. 結合力成的理念、策略與核心價值,成為最佳經營績效的世界級專業 ...

  8. Mar--Established US subsidiary Powertech Technology (USA), Inc through overseas subsidiary Powertech Holding ( B.V.I.) Inc. to serve as overseas sales and service center. Apr--Paid-in capital increased to NT$ 7,042,366,680 after conversion into common shares by convertible bonds.

  9. Core Value and Corporate Sustainable Development Policy. Establish Bilateral Connection Between Industries and Universities. Join PTI. Home. Investor Relations. Financial Information. Annual Reports. Chapter 7 Discussion and Analysis of Financial Status and Operating Results and Risk Managemen.

  10. Innovative Technology Technology at a Glance Panel Level Fan Out Bumping TSV Solution Flip Chip Antenna in Package Trademarks