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《旋轉塗覆》（英語： Spin coating ）是一種高速成膜方法，可以得到均勻的薄膜，均勻性廣泛應用於半導體材料及化工材料等薄膜製備。 它利用旋轉產生的 離心力 ，將 溶膠 、 溶液 或 懸濁液 等均勻平鋪到襯底表面。
Spin coating is a common technique for applying thin films to substrates. When a solution of a material and a solvent is spun at high speeds using a spin coater, the centripetal force and the surface tension of the liquid together create an even covering.
Spin coating is a procedure used to deposit uniform thin films onto flat substrates. Usually a small amount of coating material in liquid form is applied on the center of the substrate, which is either spinning at low speed or not spinning at all.
Spin Coating As explained previously, there are several major factors affecting the coating process. Among these are spin speed, acceleration, spin time and exhaust. Process parameters vary greatly for different resin materials and substrates so there are no
Spin coating is a laboratory technique for rapidly producing membranes. In general, this technique is used to prepare thin membranes by spinning out the precursor solution over the edge of the support.
「旋轉塗佈機」是利用 旋轉離心力 的塗佈裝置，也稱為「旋塗機」。 它可以在平滑的被塗佈物體（工件）上獲得薄而均勻的塗膜。 典型用途十分廣泛，包括從以半導體晶圓的表面處理和光阻劑塗佈為代表的製程到光盤的鍍膜、鏡頭的底漆和調光液塗佈等。 利用旋轉塗佈機的塗佈. A. 旋轉體. B. 被塗佈物體表面. C. 塗佈液體. 以被塗佈物體（工件）為中心落下塗佈液體，使其高速旋轉。 透過加速旋轉使塗佈液體受到離心力，塗佈液體擴散塗佈至整個表面並成膜。 塗佈膜厚由塗佈液體的黏度、被塗佈物體的旋轉次數、旋轉啟動加速度、乾燥速度相關的排氣決定。 旋轉塗佈機的缺點是，採用藉由旋轉離心力將多餘塗佈液體甩出被塗佈物體之外的原理，因此實際成膜的液體量少於滴下的液體量，會產生材料損耗。
Spin coating is a simple solution-based method for the fabrication of thin films with thickness in the range of nm to µm. Spin coating can be applied to a wide range of organic and inorganic materials and their composite materials [530].
