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  1. TSMC - Wikipedia

    en.wikipedia.org/wiki/TSMC
    • History
    • Technologies
    • Production Capabilities
    • Facilities
    • Sales and Market Trends
    • Sustainability

    The company has been increasing and upgrading its manufacturing capacity for most of its existence, although influenced by the demand cycles of the semiconductor industry. In 2011, the company planned to increase research and development expenditures by almost 39% to NT$50 billion in an effort to fend off growing competition. The company also planned to expand capacity by 30% in 2011 to meet strong market demand. In May 2014, TSMC's board of directors approved capital appropriations of US$568 million to establish, convert, and upgrade advanced technology capacity after the company forecast higher than expected demand.In August 2014, TSMC's board of directors approved additional capital appropriations of US$3.05 billion. In 2011, it was reported that TSMC had begun trial production of the A5 SoC and A6 SoCs for Apple's iPad and iPhone devices. According to reports, as of May 2014, Apple is sourcing its new A8 and A8X SoCs from TSMC and later sourced the A9 SoC with both TSMC and Sams...

    TSMC’s N7+ is the first commercially-available extreme-ultraviolet lithographic process in the semiconductor industry. It uses ultraviolet patterning and enables more acute circuits to be implemented on the silicon. N7+ offers a 15-20% higher transistor density and 10% reduction in power consumption than previous technology. The N7 achieved the fastest ever volume time to market, faster than 10 nm and 16 nm.The N5 iteration doubles transistor density and improves performance by an additional 15%.

    On 300 mm wafers, TSMC has silicon lithography on node sizes: 1. 0.13 μm (options: general-purpose (G), low-power (LP), high-performance low-voltage (LV)). 2. 90 nm (based upon 80GC from Q4/2006), 3. 65 nm (options: general-purpose (GP), low-power (LP), ultra-low power (ULP), LPG). 4. 55 nm (options: general-purpose (GP), low-power (LP)). 5. 40 nm (options: general-purpose (GP), low-power (LP), ultra-low power (ULP)). 6. 28 nm (options: high-performance (HP), high-performance mobile (HPM), high-performance computing (HPC), high-performance low-power (HPL), low-power (LP), high-performance computing Plus (HPC+), ultra-low power (ULP)) with HKMG. 7. 22 nm (options: ultra-low power (ULP), ultra-low leakage (ULL)) 8. 20 nm 9. 16 nm (options: FinFET (FF), FinFET Plus (FF+), FinFET Compact (FFC)) 10. 12 nm (options: FinFET Compact (FFC), FinFET NVIDIA(FFN)), enhanced version of 16 nm process. 11. 10 nm (options: FinFET (FF)) 12. 7 nm (options: FinFET (FF), FinFET Plus (FF+), FinFET Pro (F...

    Apart from its main base of operations in Hsinchu in Northern Taiwan, where several of its fab facilities are located, it also has leading-edge fabs in Southern Taiwan and Central Taiwan, with other fabs located at its subsidiaries TSMC China in Shanghai, China, WaferTech in Washington state, United States, and SSMC in Singapore,and it has offices in China, Europe, India, Japan, North America, and South Korea. The following fabs were in operation in 2020: 1. Four 300 mm "GIGAFABs" in operation in Taiwan: Fab 12 (Hsinchu), 14 (Tainan), 15 (Taichung), 18 (Tainan) 2. Four 200 mm waferfabs in full operation in Taiwan: Fab 3, 5, 8 (Hsinchu) , 6 (Tainan) 3. TSMC China Company Limited, 200 mm: Fab 10 (Shanghai) 4. TSMC Nanjing Company Limited, 300 mm: Fab 16 (Nanjing) 5. WaferTech L.L.C., TSMC's wholly owned US subsidiary, a 200 mm fab: Fab 11 (Camas, Washington) 6. SSMC (Systems on Silicon Manufacturing Co.), a joint venture with NXP Semiconductors in Singapore, 200 mm, where production s...

    TSMC and the rest of the foundry industry are exposed to the highly cyclical nature of the semiconductor industry. During upturns, TSMC must ensure that it has enough production capacity to meet strong customer demand. However, during downturns, it must contend with excess capacity because of weaker demand, and the high fixed costs associated with its manufacturing facilities.As a result, the company's financial results tend to fluctuate with a cycle time of a few years. This is more apparent in earnings than revenues because of the general trend of revenue and capacity growth. TSMC's business has generally also been seasonal with a peak in Q3 and a low in Q1. In 2014, TSMC was at the forefront of the foundry industry for high-performance, low-power applications, leading major smartphone chip companies such as Qualcomm, Mediatek and Apple to place an increasing amount of orders. While the competitors in the foundry industry (primarily GlobalFoundries and United Microelectronics Corp...

    In July 2020, TSMC signed a 20 year deal with Ørsted to buy the entire production of two offshore wind farms under development off Taiwan’s west coast. At the time of its signing it was the largest corporate green energyorder ever made.

  2. MediaTek - Wikipedia

    en.wikipedia.org/wiki/MediaTek
    • Corporate History
    • Acquisitions
    • Financial Performance
    • Product Announcements
    • Controversy
    • Product List
    • See Also
    • External Links

    MediaTek was originally a unit of the Taiwanese firm, United Microelectronics Corporation (UMC), tasked with designing chipsets for home entertainment products. On May 28, 1997, the unit was spun off and incorporated. MediaTek Inc. was listed on the Taiwan Stock Exchange(TSEC) under the "2454" code on July 23, 2001. The company started out designing chipsets for optical drives and subsequently expanded into chips for DVD players, digital TVs, mobile phones, smartphones and tablets.In general MediaTek has had a strong record of gaining market share and displacing competitors after entering new markets. The company launched a division to design products for mobile devices in 2004. Seven years later, it was taking orders for more than 500 million mobile system-on-chip units per annum, which included products for both feature phones and smart devices.By providing extensive system engineering assistance the company allowed many smaller companies and new entrants to enter a mobile phone m...

    In 2005, MediaTek acquired Inprocomm, a wireless semiconductor design company producing 802.11a, b and a/g chips. On September 10, 2007, MediaTek announced its intention to buy Analog Devices cellular radio and baseband chipset divisions for US$350 million.The acquisition was finalised by January 11, 2008. On May 5, 2011, MediaTek acquired Ralink Technology Corporation, gaining products and expertise for Wi-Fi technology for mobile and non-mobile applications, as well as for wired DSL and Ethernetconnectivity. On April 11, 2012, MediaTek acquired Coresonic, a global producer of digital signal processing products based in Linköping, Sweden. Coresonic became a wholly owned subsidiary of MediaTek in Europe. On June 22, 2012, MediaTek announced it would acquire rival Taiwanese chipset designer MStar Semiconductor Inc., which held a strong market share position in digital television chips. The initial phase of the deal saw MediaTek taking a 48 percent stake, with an option to purchase th...

    MediaTek's financial results have been subject to variation as the financial success of different product lines fluctuated. MediaTek's relatively strong sales in 2009/2010 was based on its strong market position for feature phone chipsets. Smartphone and tablet products contributed to MediaTek's sales and income increase in 2013, while revenue recognition from the acquisition of MStar Semiconductor, which became effective in February 2014, as well as a continuing strong position for smartphone and tablet solutions, were the main reasons for the sales growth seen in 2014.In 2014 smartphone chips accounted for approximately 50–55% of revenue, followed by digital home products (25–30%, includes digital television chips), tablet chips (5–10%), feature phone chips (5–10%) and Wi-Fi products (5–10%). MediaTek started shipping chips with integrated 4G LTE baseband in volume in the second half of 2014, later than its largest competitor Qualcomm. The additional cost of the separate baseband...

    The MT8135 system-on-chip (SoC) for tablets announced in July, 2013 was the industry's first chip to implement the new ARM big.LITTLE technology for heterogeneous multi-processing. A variant of the MT8135 was used by Amazon in its Kindle Fire HD tablet models. Also on November 20, 2013, MediaTek launched the MT6592 SoC, the first system-on-chip (SoC) with eight CPU cores which could be used simultaneously,in contrast to competing SoCs with eight physical cores of which only a subset could be active at any given time. The "True Octa-Core" trademark was registered to emphasize the difference in marketing materials. On January 7, 2014, MediaTek announced the development of the world's first "multimode receiver" for wireless charging. In contrast to existing implementations it is compatible with both inductive and resonant charging. The resulting MT3188 wireless charging chip, certified by both the Power Matters Alliance and the Wireless Power Consortiumwas announced on February 24, 201...

    Benchmark cheating

    On April 8, 2020, MediaTek published a post titled "Why MediaTek Stands Behind Our Benchmarking Practices", and later that day AnandTech published an article on MediaTek's Sports Mode. MediaTek said Sports Mode is designed to show full capabilities during benchmarks, that it is standard practice in the industry, and their device makers can choose to enable it or not. AnandTech pointed out Sports Mode was also being applied to benchmarks intended on measuring user experience benchmarks, provid...

    GNSS modules

    Global navigation satellite system(GNSS) modules. 1. MT6628 (GPS) WLAN 802.11b/g/n, WIFI Direct, Bluetooth 4.0 LE, GPS/QZSS, FM 2. MT6620 (GPS) 3. MT3339 (2011) (GPS, QZSS, SBAS) 4. MT3337 (GPS) 5. MT3336 (GPS) 6. MT3333/MT3332 (2013) GPS/GLONASS/GALILEO/BEIDOU/QZSS, is the world's first five-in-one multi-GNSS that supports the Beidou navigation satellite system. 7. MT3329 (GPS) 8. MT3328 (GPS) 9. MT3318 (GPS)

    IEEE 802.11

    As a result of the merger with Ralink, MediaTek has added wireless network interface controllers for IEEE 802.11-standards, and SoCs with MIPSCPUs to its product portfolio. 1. RT3883 includes a MIPS 74KEc CPU and an IEEE 802.11n-conformant WNIC. 2. RT6856 includes a MIPS 34KEc CPU and an IEEE 802.11ac-conformant WNIC.

    • May 28, 1997; 24 years ago
    • Hsinchu, Taiwan
    • 17,554 (2019)
    • NT$322.15 billion (2020)
  3. microLED - Wikipedia

    en.wikipedia.org/wiki/MicroLED
    • Research
    • Commercialization
    • See Also
    • References
    • External Links

    Inorganic semiconductor microLED (µLED) technology was first invented in 2000 by the research group of Hongxing Jiang and Jingyu Lin of Texas Tech University while they were at Kansas State University. Following their first report of electrical injection microLEDs based on indium gallium nitride (InGaN) semiconductors, several groups have quickly engaged in pursuing this concept. Many related potential applications have been identified. Various on-chip connection schemes of microLED pixel arrays have been employed allowing for the development of single-chip high voltage DC/AC-LEDsto address the compatibility issue between the high voltage electrical infrastructure and low voltage operation nature of LEDs and high brightness self-emissive microdisplays. The microLED array has also been explored as a light source for optogenetics applications and for visible light communications. Early InGaN based microLED arrays and microdisplays were primarily passively driven. The first actively dr...

    microLEDs have innate potential performance advantages over LCD displays, including higher brightness, lower latency, higher contrast ratio, greater color saturation, intrinsic self-illumination, and better efficiency. As of 2016, technological and production barriers have prevented commercialization. As of 2016 a number of different technologies were under active research for the assembling of individual LED pixels on a substrate. These include chip bonding of microLED chips onto a substrate (considered to have potential for large displays), wafer production methods using etching to produce an LED array followed by bonding to an IC, and wafer production methods using an intermediate temporary thin film to transfer the LED array to a substrate. Glo and Jasper Display Corporation demonstrated the world's first RGB microLED microdisplay, measuring 0.55 inches (1.4 cm) diagonally, at SID Display Week 2017. Glo transferred their microLEDs to the Jasper Display backplane. Sony launched a...

    Murphy, David (3 May 2014). "Apple Acquires Micro-LED Display Maker LuxVue Technology". PC Mag.
    Campos, Alvaro (13 May 2014). "Why Did Apple Inc Buy This Micro-LED Tech Startup?". Motley Fool.
  4. 2020–21 NBA season - Wikipedia

    en.wikipedia.org/wiki/2020–21_NBA_season

    From Wikipedia, the free encyclopedia. The 2020–21 NBA season was the 75th season of the National Basketball Association (NBA). Due to the COVID-19 pandemic, the regular season was reduced to 72 games for each team, and began on December 22, ...

  5. Process engineering - Wikipedia

    en.wikipedia.org/wiki/Process_engineering
    • Overview
    • Principal Areas of Focus in Process Engineering
    • History of Process Engineering
    • External Links

    Process engineering involves the utilization of multiple tools and methods. Depending on the exact nature of the system, processes need to be simulated and modeled using mathematics and computer science. Processes where phase change and phase equilibria are relevant require analysis using the principles and laws of thermodynamics to quantify changes in energy and efficiency. In contrast, processes that focus on the flow of material and energy as they approach equilibria are best analyzed using the disciplines of fluid mechanics and transport phenomena. Disciplines within the field of mechanics need to be applied in the presence of fluids or porous and dispersed media. Materials engineering principles also need to be applied, when relevant. Manufacturing in the field of process engineering involves an implementation of process synthesis steps. Regardless of the exact tools required, process engineering is then formatted through the use of a process flow diagram (PFD) where material f...

    Process engineering activities can be divided into the following disciplines: 1. Process design: synthesis of energy recovery networks, synthesis of distillation systems (azeotropic), synthesis of reactor networks, hierarchical decomposition flowsheets, superstructure optimization, design multiproduct batch plants, design of the production reactors for the production of plutonium, design of nuclear submarines. 2. Process control: model predictive control, controllability measures, robust control, nonlinear control, statistical process control, process monitoring, thermodynamics-based control, denoted by three essential items, a collection of measurements, method of taking measurements, and a system of controlling the desired measurement. 3. Process operations: scheduling process networks, multiperiod planning and optimization, data reconciliation, real-time optimization, flexibility measures, fault diagnosis. 4. Supporting tools: sequential modular simulation, equation-based process...

    Various chemical techniques have been used in industrial processes since time immemorial. However, it wasn't till the advent of thermodynamics and the law of conservation of mass in the 1780s that process engineering was properly developed and implemented as its own discipline. The set of knowledge that is now known as process engineering was then forged out of trial and error throughout the industrial revolution. The term process, as it relates to industry and production, dates back to the 18th century. During this time period, demands for various products began to drastically increase, and process engineers were required to optimize the process in which these products were created. By 1980, the concept of process engineering emerged from the fact that chemical engineering techniques and practices were being used in a variety of industries. By this time, process engineering had been defined as "the set of knowledge necessary to design, analyze, develop, construct, and operate, in a...

  6. Gas detector - Wikipedia

    en.wikipedia.org/wiki/Gas_detector
    • History
    • Types
    • Calibration
    • Oxygen Concentration
    • Ammonia
    • Combustible
    • Other
    • Household Safety
    • Research
    • See Also

    Gas leak detection methods became a concern after the effects of harmful gases on human health were discovered. Before modern electronic sensors, early detection methods relied on less precise detectors. Through the 19th and early 20th centuries, coal miners would bring canaries down to the tunnels with them as an early detection system against life-threatening gases such as carbon dioxide, carbon monoxide and methane. The canary, normally a very songful bird, would stop singing and eventually die if not removed from these gases, signaling the miners to exit the mine quickly. The first gas detector in the industrial age was the flame safety lamp (or Davy lamp) was invented by Sir Humphry Davy(of England) in 1815 to detect the presence of methane (firedamp) in underground coal mines. The flame safety lamp consisted of an oil flame adjusted to specific height in fresh air. To prevent ignition with the lamps flame was contained within a glass sleeve with a mesh flame arrestor. The flam...

    Gas detectors can be classified according to the operation mechanism (semiconductors, oxidation, catalytic, photoionization, infrared, etc.). Gas detectors come packaged into two main form factors: portable devices and fixed gas detectors. Portable detectors are used to monitor the atmosphere around personnel and are either hand-held or worn on clothing or on a belt/harness. These gas detectors are usually battery operated. They transmit warnings via audible and visible signals, such as alarms and flashing lights, when dangerous levels of gas vapors are detected. Fixed type gas detectors may be used for detection of one or more gas types. Fixed type detectors are generally mounted near the process area of a plant or control room, or an area to be protected, such as a residential bedroom. Generally, industrial sensors are installed on fixed type mild steel structures and a cable connects the detectors to a SCADAsystem for continuous monitoring. A tripping interlock can be activated f...

    All gas detectors must be calibrated on a schedule. Of the two form factors of gas detectors, portables must be calibrated more frequently due to the regular changes in environment they experience. A typical calibration schedule for a fixed system may be quarterly, bi-annually or even annually with more robust units. A typical calibration schedule for a portable gas detector is a daily "bump test" accompanied by a monthly calibration. Almost every portable gas detector requires a specific calibration gas In the US, the Occupational Safety and Health Administration (OSHA) may set minimum standards for periodic recalibration.[citation needed]

    Oxygen deficiency gas monitors are used for employee and workforce safety. Cryogenic substances such as liquid nitrogen (LN2), liquid helium (He), and liquid argon (Ar) are inert and can displace oxygen (O2) in a confined space if a leak is present. A rapid decrease of oxygen can provide a very dangerous environment for employees, who may not notice this problem before they suddenly lose consciousness. With this in mind, an oxygen gas monitor is important to have when cryogenics are present. Laboratories, MRIrooms, pharmaceutical, semiconductor, and cryogenic suppliers are typical users of oxygen monitors. Oxygen fraction in a breathing gas is measured by electro-galvanic oxygen sensors. They may be used stand-alone, for example to determine the proportion of oxygen in a nitrox mixture used in scuba diving, or as part of feedback loop which maintains a constant partial pressure of oxygen in a rebreather.

    Gaseous ammonia is continuously monitored in industrial refrigeration processes and biological degradation processes, including exhaled breath. Depending on the required sensitivity, different types of sensors are used (e.g., flame ionization detector, semiconductor, electrochemical, photonic membranes). Detectors usually operate near the lower exposure limit of 25ppm;however, ammonia detection for industrial safety requires continuous monitoring above the fatal exposure limit of 0.1%.

    There are several different sensors that can be installed to detect hazardous gases in a residence. Carbon monoxide is a very dangerous, but odorless, colorless gas, making it difficult for humans to detect. Carbon monoxide detectors can be purchased for around US$20–60. Many local jurisdictions in the United States now require installation of carbon monoxide detectors in addition to smoke detectors in residences. Handheld flammable gas detectors can be used to trace leaks from natural gas lines, propane tanks, butane tanks, or any other combustible gas. These sensors can be purchased for US$35–100.

    The European Community has supported research called the MINIGAS project that was coordinated by VTT Technical Research Center of Finland.This research project aims to develop new types of photonics-based gas sensors, and to support the creation of smaller instruments with equal or higher speed and sensitivity than conventional laboratory-grade gas detectors.

  7. Tōyō kanji - Wikipedia

    en.wikipedia.org/wiki/Tôyô_kanji
    • Reform
    • Applications and Limitations
    • Mazegaki
    • List of The 1,850 Tōyō Kanji
    • See Also
    • External Links

    Thousands of kanji characters were in use in various writing systems, leading to great difficulties for those learning written Japanese. Additionally, several characters had identical meanings but were written differently from each other, further increasing complexity. After World War II, the Ministry of Education decided to minimize the number of kanji by choosing the most commonly used kanji, along with simplified kanji (see Shinjitai) commonly appearing in contemporary literature, to form the tōyō kanji. This was an integral part of the postwar reform of Japanese national writing. This was meant as a preparation for re-introducing their previous unsuccessful reform abolishing Chinese characters. Although the postwar timing meant no public debate was held on the future of the Japanese written language, the defenders of the original kanji system considered and accepted the tōyō kanji as a reasonable compromise. Since this compromise could not then be withdrawn in favour of more rad...

    In addition to a list of the standardized tōyō kanji, the reform published by the Ministry for Education in 1946 also contains a set of guidelines for their use. Regarding provenance and scope, the foreword of the document states that: 1. The table of tōyō kanji put forth therein, are the selection of kanji recommended for use by the general public, including legal and governmental documents, newspapers, and magazines. 2. The presented kanji are selected as an approximate set of those characters found to be of no insignificant utility in the lives of today's Japanese citizens. 3. Concerning proper nouns, there is a wide range of usage beyond what may be formulated as rules, and consequently they are treated as outside the scope of this standard. 4. The simplified character forms from modern custom are taken as the proper form, and their original forms are provided alongside them for reference. 5. A systemization of the character forms and their readings is still under consideration...

    Because the majority of character-based words are composed of two (or more) kanji, many words were left with one character included in the Tōyō kanji, and the other character missing. In this case, the recommendation was to write the included part in kanji and the excluded part in kana, e.g. ふ頭 for 埠頭 and 危ぐ for 危惧. These words were called mazegaki(交ぜ書き, "mixed characters").

    Bold in 1981 and 2010 year added kanji 一 丁 七 丈 三 上 下 不 且 世 丘 丙 中 丸 丹 主 久 乏 乗 乙 九 乳 乾 乱 了 事 二 互 五 井 亜 亡 交 享 京 人 仁 今 介 仕 他 付 代 令 以 仰 仲 件 任 企 伏 伐 休 伯 伴 伸 伺 似 但 位 低 住 佐 何 仏 作 佳 使 来 例 侍 供 依 侮 侯 侵 便 係 促 俊 俗 保 信 修 俳 俵 併 倉 個 倍 倒 候 借 倣 値 倫 仮 偉 偏 停 健 側 偶 傍 傑 備 催 伝 債 傷 傾 働 像 僚 偽 僧 価 儀 億 倹 儒 償 優 元 兄 充 兆 先 光 克 免 児 入 内 全 両 八 公 六 共 兵 具 典 兼 冊 再 冒 冗 冠 冬 冷 准 凍 凝 凡 凶 出 刀 刃 分 切 刈 刊 刑 列 初 判 別 利 到 制 刷 券 刺 刻 則 削 前 剖 剛 剰 副 割 創 劇 剤 剣 力 功 加 劣 助 努 効 劾 勅 勇 勉 動 勘 務 勝 労 募 勢 勤 勲 励 勧 勺 匁 包 化 北 匠 匹 匿 区 十 千 升 午 半 卑 卒 卓 協 南 博 占 印 危 却 卵 巻 卸 即 厘 厚 原 去 参 又 及 友 反 叔 取 受 口 古 句 叫 召 可 史 右 司 各 合 吉 同 名 后 吏 吐 向 君 吟 否 含 呈 呉 吸 吹 告 周 味 呼 命 和 咲 哀 品 員 哲 唆 唐 唯 唱 商 問 啓 善 喚 喜 喪 喫 単 嗣 嘆 器 噴 嚇 厳 嘱 囚 四 回 因 困 固 圏 国 囲 園 円 図 団 土 在 地 坂 均 坊 坑 坪 垂 型 埋 城 域 執 培 基 堂 堅 堤 堪 報 場 塊 塑 塔 塗 境 墓 墜 増 墨 堕 墳 墾 壁 壇 圧 塁 壊 士 壮 壱 寿 夏 夕 外 多 夜 夢 大 天 太 夫 央 失 奇 奉 奏 契 奔 奥 奪 奨 奮 女 奴 好 如 妃 妊 妙 妥 妨 妹 妻 姉 始 姓 委 姫 姻 姿 威 娘 娯 娠 婆 婚 婦 婿 媒 嫁 嫡 嬢 子 孔 字 存 孝 季 孤 孫 学 宅 宇 守 安 完 宗 官 宙 定 宜 客 宣 室 宮 宰 害 宴 家 容 宿 寂 寄 密 富 寒 察 寡 寝 実 寧 審 写 寛 寮 宝 寸 寺 封 射 将 専 尉 尊 尋 対 導 小 少 就 尺 尼 尾 尿 局 居 届 屈...

  8. Kyōiku kanji - Wikipedia

    en.wikipedia.org/wiki/Gakunenbetsu_kanji_haitōhyō

    Kyōiku kanji (教育漢字, literally "education kanji"), also known as Gakunenbetsu kanji haitōhyō (学年別漢字配当表, literally "list of kanji by school year") is a list of 1,026 kanji and associated readings developed and ...

  9. Charged-device model - Wikipedia

    en.wikipedia.org/wiki/Charged-device_model

    Charged-device model. The charged-device model ( CDM) is a model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge (ESD). The model is an alternative to the human-body model (HBM). Devices that ...

  10. Differences between Shinjitai and Simplified characters - Wikipedia

    en.wikipedia.org/wiki/Differences_in_Shinjitai_and...
    • List of Different Simplifications
    • Traditional Characters That May Cause Problems Displaying
    • Different Stroke Orders in Chinese and Japanese

    The old and new forms of the Kyōiku Kanji and their Hànzì equivalents are listed below. In the following lists, the characters are sorted by the radicals of the Japanese kanji. The two Kokuji 働 and 畑 in the Kyōiku-Kanji List, which have no Chinese equivalents, are not listed here. Note that 弁 is used to simplify three different Traditional characters (辨, 瓣, and 辯) in Japan. 1. No simplificationin either language (The following characters were simplified neither in Japanese nor in Chinese.) 1. 一 丁 下 三 不 天 五 民 正 平 可 再 百 否 武 夏 中 内 出 本 世 申 由 史 冊 央 向 曲 印 州 表 果 半 必 永 求 九 丸 千 久 少 夫 午 失 末 未 包 年 危 后 兵 我 束 卵 承 垂 刷 重 省 看 勉 七 乳 才 予 事 二 元 亡 六 主 市 交 忘 夜 育 京 卒 商 率 就 人 化 今 仁 付 代 仕 他 令 以 合 全 任 休 件 仲 作 何 位 住 余 低 似 命 使 念 例 供 信 保 便 値 修 借 候 倍 俳 俵 健 停 働 像 先 入 八 分 公 共 弟 並 典 前 益 善 尊 同 周 次 兆 冷 弱 刀 切 別 判 制 券 刻 副 割 力 加 助 努 勇 勤 句 北 疑 十 古 孝 直 南 真 裁 博 上 反 灰 厚 原 台 能 友 収 口 司 右 兄 吸 告 君 味 呼 品 唱 器 四 回 因 困 固 土 去 地 在 寺 均 志 坂 幸 型 城 基 域 喜 境 士 冬 各 夕 外 名 多 大 太 奏 女 好 始 妻 姉 妹 姿 子 存 安 字 守 宅 宇 完 定 官 宙 宗 室 客 宣 家 害 案 容 宮 寄 密 宿 寒...

    Some of the traditional Kanji are not included in the Japanese font of Windows XP/2000, and only rectangles are shown. Downloading the Meiryo font from the Microsoft website (VistaFont_JPN.EXE) and installing it will solve this problem. Note that within the Jōyō Kanji there are 62 characters the old forms of which may cause problems displaying: Kyōiku Kanji (26): Grade 2 (2 Kanji): 海 社 Grade 3 (8 Kanji): 勉 暑 漢 神 福 練 者 都 Grade 4 (6 Kanji): 器 殺 祝 節 梅 類 Grade 5 (1 Kanji): 祖 Grade 6 (9 Kanji): 勤 穀 視 署 層 著 諸 難 朗 Secondary-School Kanji (36): 欄 廊 虜 隆 塚 祥 侮 僧 免 卑 喝 嘆 塀 墨 悔 慨 憎 懲 敏 既 煮 碑 祉 祈 禍 突 繁 臭 褐 謁 謹 賓 贈 逸 響 頻 These characters are Unicode CJK Unified Ideographs for which the old form (kyūjitai) and the new form (shinjitai) have been unified under the Unicode standard. Although the old and new forms are distinguished under the JIS X 0213 standard, the old forms map to Unicode CJK Compatibility Ideographs which are considered by Unicode to be canonically equivalent to the new forms and ma...

    Some characters, whether simplified or not, look the same in Chinese and Japanese, but have different stroke orders. For example, in Japan, 必 is written with the top dot first, while the Traditional stroke order writes the 丿 first. In the characters 王 and 玉, the vertical stroke is the third stroke in Chinese, but the second stroke in Japanese.Taiwan and Hong Kong use Traditional characters, though with an altered stroke order.

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