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  1. en.wikipedia.org › wiki › 2_nm_process2 nm process - Wikipedia

    2 nm process. In semiconductor manufacturing, the "2 nm process" is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the "3 nm" process node. The term "2 nanometer " or alternatively "20 angstrom " (a term used by Intel) has no relation to any actual physical feature (such as gate length, metal pitch or ...

  2. en.wikipedia.org › wiki › TSMCTSMC - Wikipedia

    TSMC. Taiwan Semiconductor Manufacturing Company Limited ( TSMC; also called Taiwan Semiconductor) [4] [5] is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's second-most valuable semiconductor company, [6] the world's largest dedicated independent ("pure-play") semiconductor foundry, [7] and ...

    • 73,090 (2022)
    • US$73.67 billion (2022)
    • Background
    • Technology Demos
    • Shipping Devices

    The resolutions of a "14 nm" device are difficult to achieve in a polymeric resist, even with electron beam lithography. In addition, the chemical effects of ionizing radiation also limit reliable resolution to about 30 nm, which is also achievable using current state-of-the-art immersion lithography. Hardmask materials and multiple patterningare r...

    In the late 1990s, Hisamoto's Japanese team from Hitachi Central Research Laboratory began collaborating with an international team of researchers on further developing FinFET technology, including TSMC's Chenming Hu and various UC Berkeley researchers. In 1998, the team successfully fabricated devices down to a 17nm process. They later developed a...

    In 2013, SK Hynix began mass-production of "16nm" NAND flash, TSMC began "16nm" FinFET production, and Samsung began "10nmclass" NAND flash production. On September 5, 2014, Intel launched the first three Broadwell-based processors that belonged to the low-TDP Core M family: Core M-5Y10, Core M-5Y10a, and Core M-5Y70.[needs update] In February 2015...

  3. en.wikipedia.org › wiki › 5_nm_process5 nm process - Wikipedia

    5 nm process. In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the "5 nm" process as the MOSFET technology node following the "7 nm" node. In 2020, Samsung and TSMC entered volume production of "5 nm" chips, manufactured for companies including Apple, Marvell, Huawei and Qualcomm. [1] [2]

  4. Semiconductor industry in Taiwan. The semiconductor industry, including Integrated Circuit (IC) manufacturing, design, and packaging, forms a major part of Taiwan 's IT industry. [1] Due to its strong capabilities in OEM wafer manufacturing and a complete industry supply chain, Taiwan has been able to distinguish itself as a leading microchip ...

  5. The 90 nm process refers to the technology used in semiconductor manufacturing to create integrated circuits with a minimum feature size of 90 nanometers. It was an advancement over the previous 130 nm process. Eventually, it was succeeded by smaller process nodes, such as the 65 nm, 45 nm, and 32 nm processes .

  6. en.wikipedia.org › wiki › 3_nm_process3 nm process - Wikipedia

    3 nm process. 1.5 µm – 1981. In semiconductor manufacturing, the "3 nm" process is the next die shrink after the "5 nm" MOSFET (metal–oxide–semiconductor field-effect transistor) technology node. South Korean chipmaker Samsung started shipping its "3 nm" gate all around (GAA) process, named "3GAA", in mid-2022.